Precut processing of logs by cutting partially through a workpiece

ABSTRACT

A precut module with one or more profiling heads and/or circular saws may be provided upstream of a saw module. The precut module may be used to implement a portion of a cut that would otherwise be made by the saw module, thereby reducing the depth of cut required at the saw module. In some embodiments, profiling heads may be used to profile a block that is wider than a desired side board. The block may be cut from the workpiece and sent to the edger. This may provide the same or better wood volume recovery and/or throughput speed than profiling the side board or cutting the side board from a flitch. In some embodiments, cut patterns for the precut module and other machine centers may be calculated and/or selected based on a desired depth of cut at the saw module, desired throughput speed, wood volume recovery, and/or other parameters.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional PatentApplication No. 62/141,062, filed Mar. 31, 2015 titled “PrecutProcessing of Logs,” the entire disclosure of which is incorporated byreference herein.

BACKGROUND

Logs are typically processed in two or more phases. The first phase, orprimary breakdown, involves chipping/cutting the logs into one or morepieces. Additional cuts are made to some or all of the pieces in thesecond phase, or secondary breakdown. Due to their generally cylindricalshape, logs are often cut to obtain side boards from the curved outerperiphery of the log. The side boards are produced at a desired width,and are subsequently trimmed to a desired length downstream of thesecondary breakdown system.

Some processing lines are configured to produce side boards in theprimary breakdown phase. These primary breakdown systems usually have achipper, a profiler, and a saw module. The chipper chips open facesalong opposite sides of the log to form a cant. The profiler chips thesides of the cant to form the profile of the desired side boards. Thesaw module cuts through the cant to release the side boards from theremainder of the cant.

Other processing lines are configured to produce side boards in thesecondary breakdown phase. In common configurations the primarybreakdown system has a chipper and a saw module, and the secondarybreakdown system has an edger. The chipper chips open faces alongopposite sides of the log, and the saw module cuts through the resultingcant to sever flitches from the remainder of the cant. The edger cutsthe flitches longitudinally to produce the desired side boards.

In the first configuration, the longitudinal sides of the side boardsare formed by the profiler before the side boards are cut from the cant.In the second configuration, the longitudinal sides of the side boardsare formed by the edger after the flitch has been cut from the cant.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments will be readily understood by the following detaileddescription in conjunction with the accompanying drawings. Embodimentsare illustrated by way of example and not by way of limitation in thefigures of the accompanying drawings.

FIG. 1 illustrates a schematic plan view of a processing line with aprecut module;

FIGS. 2A-2B illustrate examples of a chipper/precut saw section of aprecut module;

FIG. 3A illustrates a schematic view of a profiler section of a precutmodule;

FIGS. 3B-3C illustrate schematic views of examples of cut patterns for aprofiler section;

FIG. 4A illustrates a schematic view of a precut saw section of a precutmodule;

FIGS. 4B-4C illustrate schematic views of examples of cut patterns for aprecut saw section;

FIGS. 5A-5B illustrate front elevational views of profiler and precutsaw section configurations;

FIGS. 6A-6B illustrate front elevational and perspective views,respectively, of another profiler section configuration;

FIGS. 7A-7B illustrate front elevational and perspective views,respectively, of another precut saw section configuration;

FIG. 8 illustrates a perspective view of another precut moduleconfiguration;

FIGS. 9A-9B illustrate front elevational and side elevational views,respectively, of a saw module;

FIG. 10 illustrates a plan view of a primary breakdown systemconfiguration that includes a precut module with a chipper section and aprofiler/precut saw section;

FIG. 11 illustrates a plan view of another primary breakdown systemconfiguration that includes a precut module with a chipper section andtwo profiler/precut saw sections;

FIG. 12 illustrates a plan view of a primary breakdown systemconfiguration that includes a precut module with two precut sawsections;

FIG. 13 illustrates a plan view of a primary breakdown system thatincludes a precut module with a chipper section and a precut sawsection;

FIGS. 14A-H illustrate schematic views of alternative cut patterns for apredicted cut product;

FIG. 15 illustrates a flow chart of a method for processing a workpiece;

FIG. 16 illustrates a flow chart of another method for processing aworkpiece;

FIG. 17 illustrates a flow chart of another method for processing aworkpiece;

FIG. 18 illustrates a flow chart of a method for processing a workpiece;and

FIG. 19 illustrates an example of a computing device suitable forperforming various methods described herein, all in accordance withvarious embodiments.

DETAILED DESCRIPTION OF DISCLOSED EMBODIMENTS

In the following detailed description, reference is made to theaccompanying drawings which form a part hereof, and in which are shownby way of illustration embodiments that may be practiced. It is to beunderstood that other embodiments may be utilized and structural orlogical changes may be made without departing from the scope. Therefore,the following detailed description is not to be taken in a limitingsense, and the scope of embodiments is defined by the appended claimsand their equivalents.

Various operations may be described as multiple discrete operations inturn, in a manner that may be helpful in understanding embodiments;however, the order of description should not be construed to imply thatthese operations are order dependent.

The description may use perspective-based descriptions such as up/down,back/front, and top/bottom. Such descriptions are merely used tofacilitate the discussion and are not intended to restrict theapplication of disclosed embodiments.

In some embodiments, a computing device may be endowed with one or morecomponents of the disclosed apparatuses and/or systems, and may beemployed to perform one or more methods as disclosed herein.

The terms “coupled” and “connected,” along with their derivatives, maybe used. It should be understood that these terms are not intended assynonyms for each other. Rather, in particular embodiments, “connected”may be used to indicate that two or more elements are in direct physicalor electrical contact with each other. “Coupled” may mean that two ormore elements are in direct physical or electrical contact. However,“coupled” may also mean that two or more elements are not in directcontact with each other, but yet still cooperate or interact with eachother.

For the purposes of the description, a phrase in the form “A/B” or inthe form “A and/or B” means (A), (B), or (A and B). For the purposes ofthe description, a phrase in the form “at least one of A, B, and C”means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B and C).For the purposes of the description, a phrase in the form “(A)B” means(B) or (AB) that is, A is an optional element.

The description may use the terms “embodiment” or “embodiments,” whichmay each refer to one or more of the same or different embodiments.Furthermore, the terms “comprising,” “including,” “having,” and thelike, as used with respect to embodiments, are synonymous.

As used herein, the terms “depth of cut” and “cut depth” refer to thethickness of the material, along the plane of the cut, through which thecut is to be made. Generally, the depth of cut required to cut through agiven workpiece along a given plane is substantially equal to thethickness of the workpiece along the plane of the cut. The depth of cutrequired to cut only partially through the workpiece is substantiallyequal to the thickness (along the plane of the cut) of the correspondingportion of wood that is to be cut. The location of that portion of woodrelative to the rest of the workpiece does not dictate the depth of cut.For example, completing the last four inches of a ten-inch through-cutrequires a four inch depth of cut, whether the last four inches is atone end of the through-cut or between the ends of the through-cut.

As used herein, a “workpiece” is a piece of wood or wood substitutematerial. Examples of workpieces include, but are not limited to, felledtrees, stems, logs, slabs, cants, flitches, boards, veneer, plywood,laminated lumber/timber, fiberboard, insulation board,oriented-strand-board, hard-board, particle board, and any other piecesof solid wood or wood substitute materials such as (but not limited to)any wood composite material (e.g., fiber-plastic composites,fiber-cement composites), engineered/formed wood product, or other woodsubstitutes (e.g., cork, bamboo, plastics).

As used herein, the term “cut product” refers generally to any workpiececut from a larger workpiece. A “final cut product” is a workpiece towhich no additional cuts are to be made by the primary or secondarybreakdown systems. In contrast, an “intermediate cut product” is aworkpiece to which one or more additional cuts are to be made by theprimary or secondary breakdown systems to obtain a final cut product.

As used herein, a “primary workpiece” is a workpiece that is round,ovoid, or otherwise non-rectangular in cross-section. Examples ofprimary workpieces include, but are not limited to, logs and stems. Logsthat have been cut or chipped along one, two, or three sides of the logcan also be “primary workpieces.” Primary workpieces may be consideredto have a central portion that is generally rectangular in cross-sectionand one or more peripheral portions that is/are roughly crescent-shapedin cross-section. A primary workpiece can be cut longitudinally toobtain various cut products including, but not limited to, flitches,cants, slabs, side boards, and blocks.

As used herein, the terms “flitch” and “cant” refer to cut products withgenerally opposite faces that are machined (e.g., chipped or sawn) andlongitudinal sides that are portions of the outer surface of the primaryworkpiece. A flitch includes less than half of the central portion ofthe primary workpiece. In contrast, a cant includes at least half of thecentral portion of the primary workpiece. A “slab” is a cut product withone machined face and a curved outer surface. A slab may represent someor all of a peripheral portion of a primary workpiece.

As used herein, the terms “side board” and “block” refer to cut productsthat have generally opposite machined faces and at least onelongitudinal side that is machined along all or part of its length, A“side board” has the longitudinal sides and width of the correspondingfinal cut product. In contrast, a “block” is wider than thecorresponding final cut product, and does not have both longitudinalsides of the final cut product. Thus, a block must be cut longitudinallyto obtain corresponding final cut product. A block is necessarily anintermediate cut product, but a side board can be either an intermediatecut product or a final cut product (e.g., after being trimmed to thedesired length).

As used herein, a “cut solution” is a plan or scheme according to whicha workpiece can be cut into one or more smaller workpieces ofsubstantially predefined dimensions. Typically, a cut solution defines agroup of predicted cuts and their spatial arrangement relative to oneanother, and the predicted cuts collectively define the dimensions ofthe predicted workpiece(s). Some cut solutions may define one or morepredicted cuts that would produce only one predicted workpiece. Othersmay define multiple predicted cuts that would produce two or morepredicted workpieces. Some cut solutions may also define the spatialarrangement of predicted workpieces relative to one another, and/or tothe primary workpiece, prior to implementation of the cut solution.Optionally, in some embodiments a cut solution may be represented as agroup of cut lines. For example, a cut solution may be represented as agroup of cut lines on a 2D/3D model of the primary workpiece to indicatethe arrangement and locations of the predicted cuts and predictedworkpieces relative to the primary workpiece.

As used herein, a “cut pattern” is a plan or scheme for implementing acorresponding cut solution or some portion thereof. Typically, a cutpattern defines the location(s) of one or more of the predicted cutsrelative to a corresponding workpiece, which may be either the primaryworkpiece or a cut product. Optionally, a cut pattern may be define thelocation(s) of the cut line(s) relative to an image or 2D/3D model ofthe corresponding workpiece. The electronic instructions or commandsthat cause a cutting device to make the predicted cut(s) in the givenworkpiece at the defined locations may also be referred to as a “cutpattern.” Thus, in some embodiments a cut pattern may designate oridentify a particular cutting machine or machine center (e.g., chipper,profiler, gang saw, band saw, or edger), and/or a particular cuttingmember (e.g., a particular saw blade, profiling head, or chip head, oredger saw) that is to make the predicted cuts in the workpiece.

In some cases, a group of cut patterns for a given cut solution mayinclude all of the cut patterns required to fully implement the cutsolution. In other cases, a group of cut patterns may include only thecut pattern(s) that corresponds to a particular part of the cutsolution. For example, the configuration of a processing line mightallow some predicted cut lines (e.g., those that define the longitudinalsides and inner face of a predicted side board) to be implemented in anyof several different ways by different combinations of machine centers.For that part of the cut solution, multiple groups of cut patterns maybe calculated, and each of the groups may include cut patterns for thecorresponding machine centers. But another predicted cut line (e.g., onethat defines the outer face of the predicted side board or the innerface of a predicted center board) might be implemented in a given wayregardless of which group of cut patterns is implemented. A single cutpattern may be calculated for implementing that predicted cut line, andmay or may not be included in each group of cut patterns. Alternatively,a cut pattern for that predicted cut line could be calculated separatelyfor each group of cut patterns. Thus, in some embodiments two group ofcut patterns may include at least one cut pattern that is common toboth. In other embodiments, two groups of cut patterns may lack a cutpattern that is common to both.

In prior breakdown systems and methods, a workpiece such as a log is cutsequentially into pieces by saws or by a combination ofchippers/profilers and saws. Each saw cut is a through-cut. The speed atwhich a given saw module can process a workpiece depends in part on thedepth of cut required. As the required depth of cut increases,throughput speed through the saw module decreases, and vice versa.

The throughput speed of the processing line is limited by the slowestmachine center, which is often a saw module. Chippers and profilers aregenerally capable of higher throughput speeds than saws. Therefore, oneway to reduce the depth of cut is to remove all of the extraneous woodthat would otherwise be cut by the saw. This is done by using profilerupstream of the saw module to chip away all of the wood that lies withinthe plane of the desired cut product (e.g., a side board) between thedesired cut product and the corresponding outer surface of theworkpiece. The remaining portion of wood has the longitudinal sides,width, and one face of the desired cut product. This portion can besevered from the rest of the workpiece at the saw module and trimmed toobtain the side board. The depth of cut required at the saw module isthereby reduced from the width of the workpiece (e.g., as is necessaryto cut a flitch from the workpiece) to the lesser width of the sideboard. The reduction in the required depth of cut allows the saw moduleto operate at greater speed.

Although profiling the side board may provide a benefit in terms ofthroughput speed, there may be a cost in terms of recovery. An edger maycut a side board from a flitch with greater accuracy/precision thanwould be obtained by profiling to the desired dimensions. Thus, in somecases profiling a side board may be faster, but less accurate/precise,resulting in lower recovery. The relative value of each option isaffected by factors such as raw material costs, equipment-related costs,the market price/value of the various cut product(s), and the cutpatterns of preceding/succeeding workpieces. For example, as materialcosts decline, maximizing throughput may become more valuable thanmaximizing recovery, which tips the scale in favor of profiling the sideboard instead of using the edger to cut the side board from a flitch. Asmaterial costs rise, the reverse may be true.

Embodiments described herein provide methods, systems, and apparatusesfor processing workpieces to increase throughput without significantlyreducing recovery, or vice versa.

In various embodiments, a precut module with one or more cuttingmembers, such as profilers and/or circular saws, may be used to cut aworkpiece in order to remove material that would otherwise be sawn by adownstream saw module. This may effectively reduce the depth of cutrequired at the saw module, which may in turn increase the rate at whichthe saw module can process the workpiece.

In some embodiments, the precut module may include a profiler section.The profiler section may be used to form the profile of a block that iswider than a desired cut product (e.g., a side board). The block may besevered by the saw module and sent to an edger to be cut longitudinallyto the width of the desired cut product. Removing some, but not all, ofthe extraneous material around the desired cut product may allow fasterthroughput through the saw module than cutting a corresponding flitch.In addition, the straight edges of the block may allow the edger toposition and cut the block more quickly/accurately than a flitch, whichmay increase wood volume recovery. Using the edger to form thelongitudinal sides of the desired cut product may provide greatercutting accuracy, more options for final cut products, and/or increasedwood volume recovery than profiling the workpiece to the width of thedesired cut product.

In other embodiments, the precut module may have one or more precutsaws. The precut saw(s) may be used to cut the workpiece along a firstportion of a predicted cut line, and a downstream saw module may be usedto cut the workpiece along a remaining second portion of the predictedcut line to thereby complete a through-cut through the workpiece. Theprecut saws may be one or more circular saws that are operable to cutpartially through the workpiece. The downstream saw module may includeone or more circular saws, band-type saws, or any other type of cuttingmember suitable for use to complete the cut begun by the precut saw(s).Distributing the required depth of cut among the first and second sawsmay allow faster throughput through the downstream saw module.

In some embodiments, the precut module may be operatively coupled with ascanner/optimizer system. The scanner/optimizer system may be configuredto calculate two or more groups of cut patterns for a given workpiece.One of the groups of cut patterns may include a cut pattern configuredfor implementation by a profiler, and another of the groups of cutpatterns may include a cut pattern configured for implementation by anedger. Optionally, another of the groups of cut patterns may include acut pattern configured for implementation by the profiler and anothercut patter configured for implementation by the edger. Thescanner/optimizer system may be configured to determine a value for eachgroup of cut patterns based on predicted throughput speed, wood volumerecovery, and/or one or more other parameters, and to select one of thegroups of cut patterns for implementation based on the determined value.

In other embodiments, the scanner/optimizer may be configured tocalculate a cut solution and/or cut pattern(s) based at least in part ona threshold value for a given parameter, such as throughput speed orwood volume recovery. For example, the scanner/optimizer may beconfigured to calculate the cut solution/pattern(s) that represents thegreatest wood volume recovery attainable for a predetermined throughputspeed through a saw module, or the greatest throughput speed attainablefor a predetermined wood volume recovery. As another example, thescanner/optimizer may be configured to calculate the cutsolution/pattern(s) that represents the best value, in terms of a givenvariable (e.g., greatest profit, shortest time to fill an order for acustomer, greatest throughput volume through the processing line, orsmallest gaps between workpieces), that is attainable in view of anotherpredetermined parameter (e.g., throughput speed, wood volume recovery,profit, positioning range of a cutting member).

FIG. 1 illustrates a schematic plan view of a workpiece processingsystem with a precut module, in accordance with various embodiments.Examples of precut module configurations, saw modules, and processinglines are illustrated in FIGS. 2-13 and discussed further below. FIGS.14A-G illustrate schematic views of a cut solution and corresponding cutpatterns.

Referring first to FIG. 1, in various embodiments a workpiece processingsystem 100 may include a primary breakdown system and a secondarybreakdown system. The primary breakdown system may include a precutmodule 102 and a first saw module 104 downstream of precut module 102.The secondary breakdown system may include a second saw module 110downstream of first saw module 104. Workpiece processing system 100 mayfurther include one or more additional components, such as ascanner/optimizer system 116, one or more conveyors 106/108, a third sawmodule 112 and/or a fourth saw module 114. In some embodiments, secondsaw module 108 may be an edger, third saw module 112 may be a gang saw,and fourth saw module 114 may be a trimmer. Optionally, precut module102, first saw module 104, and/or third saw module may be arrangedsequentially along a flow axis (FIG. 1, dashed line). In someembodiments, second saw module 108 and/or fourth saw module 114 may bearranged along the same flow axis or along other paths of flow.

Precut Module

The precut module 102 may be operable to chip or cut a workpiece alongpart of a predicted through-cut upstream of the first saw module. Theresulting reduction in the depth of cut required at the first saw moduleto complete the through-cut may allow increased processing speed and/orthroughput through the first saw module. The precut module typicallyincludes one or more cutting members such as chip heads, profilingheads, or circular saws. The configuration of the cutting members andother components of the precut module may vary among embodiments.

In some embodiments, a precut module may have two, three, four, or morethan four sections, and the cutting members may be distributed among twoor more of the sections. Optionally, one or more sections may have feedrolls, positioning rolls/pins, or other such feed/positioning devicesinstead of, or in addition to, a cutting member. Precut modules withsuch multiple section configurations may be easier and less expensive toupgrade or reconfigure (e.g., by adding another section) to accommodatechanges in log diet or market demand. A multiple section configurationmay also allow one section to remain in use while another section isoffline. However, the multiple section configuration is not intended tobe limiting, and in other embodiments a precut module may have only onesection. For example, in some precut modules two or more types ofcutting members may be arranged within a single section rather thanamong multiple sections.

In various embodiments, a section of a precut module may have a pair ofcutting members that are arranged on generally opposite sides of a flowaxis (FIG. 1, dashed line) extending through the precut module. Pairedcutting members may be repositionable independently of one another insome embodiments. Alternatively, some paired cutting members may bemechanically linked for synchronous positioning relative to the flowaxis or other point of reference. Optionally, in some embodiments asection may have feed rolls or other feeding/positioning devices inaddition to, or instead of, a cutting member.

Optionally, a section or its cutting member(s) may be configured to belaterally, vertically, and/or axially repositionable, pivotable around avertical axis, and/or pivotable around a horizontal axis. In someembodiments a precut module may include a carriage that is selectivelyactuable to reposition one or more of the sections or cutting members.For example, a section may have a pair of cutting members supported on acorresponding pair of carriages 124 disposed on opposite sides of thecenter axis, and the carriages may be selectively movable toward andaway from the flow axis along a rail 126 (see e.g., FIGS. 2A, 2B and 5A,5B). Alternatively, two or more sections may be mounted to a commoncarriage or pair of carriages that are slideable along rails orientedparallel to, or perpendicular to, the flow axis. In other embodiments aprecut module may include a frame that is selectively repositionable.For example, a section may have a frame 128 that is moveable along,and/or pivotable around, a vertical axis 130, a horizontal axis 132,and/or a pivot pin 134 (see e.g., FIGS. 3A, 4A). In still otherembodiments, a section may have a frame that is configured to remainstationary and cutting member(s) that are selectively repositionablerelative to the frame.

In some embodiments, multiple sections of a precut module may bearranged with little or no gap between them (see e.g., FIGS. 6-8).Optionally, two or more sections of a precut module may be mechanicallycoupled together, such as by a common frame, rail, support, conveyor,carriage, or other such component.

In various embodiments, some or all of the sections may be conventionalchipper modules, profiler modules, or saw modules.

Referring again to FIG. 1, some embodiments may include a precut module102 with three sections 102 a, 102 b, and 102 c. Section 102 a may beconfigured to form a generally planar face along one side or oppositesides (e.g., lateral sides and/or top and bottom) of a primaryworkpiece, such as a log or a cant. Section 102 b may be configured toprofile the generally planar faces or to cut partially through theprimary workpiece longitudinally. Section 102 c may also be configuredto profile or cut partially through the primary workpiece.

In some embodiments, section 102 a may include paired chip heads 118(see e.g., FIGS. 2A, 8). Chip heads 118 may be conical chip heads, discchip heads, drum chip heads, or any other suitable type of chip head.Chip heads 118 may be disposed on opposite lateral sides of the flowaxis or above and below the flow axis. In some embodiments, section 102a may have two side chip heads, a top chip head, and a bottom chip head.Alternatively, some precut modules may include two sections 102 a, onehaving lateral chip heads and the other having upper and lower chipheads. While the chip heads will typically be provided in pairs, someembodiments may have a section with only one chip head. In suchembodiments, a corresponding chip head may be provided upstream ordownstream of that section, or the processing line may be configured tomove the primary workpiece through the section again in a differentrotational position to form another generally planar face.

In other embodiments, section 102 a may have one or more saws that areoperable to form a generally planar face by cutting a slab from the log.For example, section 102 a may have one or more band saws, pairedcircular saws, or other suitable types of saws.

Regardless, section 102 a may be configured to open opposite faces alonga log to produce a two-sided cant, and/or to open opposite faces along atwo-sided cant to produce a four-sided cant. In various embodiments,section 102 a may be a conventional chipper, slabber, or saw assembly.Some embodiments may have two sections 102 a. Other embodiments may lacka section 102 a.

In some embodiments, section 102 b may have one or more pairs ofprofiling heads 136. Profiling heads 136 may be of any suitable type orconfiguration. In some embodiments, pairs of profiling heads 136 may bemounted on a pair of arbors 138. Arbors 138 may be horizontal arbors(see e.g., FIG. 3A, 6A-B, 8) or vertical arbors (see e.g., FIG. 5A),Optionally, some or all of the profiling heads 136 may be selectivelyrepositionable along the corresponding arbors 138. Alternatively,profiling heads 136 may be fixed in position along arbors 138, andarbors 138 or section 102 b may be selectively repositionable laterally,vertically, and/or around a vertical pivot axis. Collectively, profilingheads 136 may be configured to profile opposite faces of a primaryworkpiece 140 (see e.g., FIGS. 3A, 4A) such as a log or cant. In someembodiments, one or more of the profiling heads 136 may be steppedprofiling heads operable to profile one or more side boards of a desiredsize along the primary workpiece.

In other embodiments, section 102 b may have one or more presaws, suchas circular saws 120, selectively operable to make cuts along theprimary workpiece without cutting completely through the primaryworkpiece. Circular saws 120 may be mounted individually or in multipleson corresponding arbors 122. For example, section 102 b may include apair of upper circular saws 120 and a pair of lower circular sawsmounted on a pair of arbors 122. Arbors 122 may be horizontal arbors(see e.g., FIG. 4A, 7A-B) or vertical arbors (see e.g., FIG. 5B). Insome embodiments, some or all of the circular saws 120 may beselectively repositionable along the corresponding arbors 122.Alternatively, some or all of the circular saws 120 may be fixed inposition along arbors 122, and arbors 122 and/or section 102 b may beselectively repositionable laterally, vertically, and/or around avertical pivot axis. Optionally, in some presaw modules, one arbor 122may be positioned slightly upstream of another arbor 122.

In some embodiments, circular saws 120 may be mounted individually or inmultiples on separate arbors 122 that are positioned on opposite sidesof the flow axis (see e.g., FIG. 2B). In a particular embodiment, arbors122/138 may be configured to accommodate a profiling head and a circularsaw interchangeably, such that the profiling heads can be removed fromthe arbors and substituted with circular saws or vice versa.Alternatively, section 102 b or another section may be configured toaccommodate both arbors 122 and arbors 138 to allow profiling heads tobe substituted with circular saws and vice versa, or to accommodate bothcircular saws and profiling heads simultaneously. In some embodimentssection 102 b may have only one arbor 122 and/or only circular saw 120.In various embodiments, section 102 b may be a conventional profilerunit or circular saw module.

Section 102 c may also be configured to pre-cut the primary workpieceupstream of saw module 104. In some embodiments, sections 102 b and 102c may be profiler modules collectively operable to profile an outerblock or side board and an inner block or side board along the same sideof the workpiece (see e.g., FIGS. 6A-B; see also FIG. 3C, showing a cutpattern for a dual profiler configuration). In other embodiments,sections 102 b and 102 c may be precut saw sections with correspondingcircular saws collectively operable to cut partially through a workpiecealong cut lines for an outer flitch and an inner flitch (see e.g., FIGS.4A and 7A-B; see also FIG. 4C, showing a cut pattern for a dual presawconfiguration). Alternatively, section 102 b may include a profiler andsection 102 c may include one or more circular saws, or vice versa. Insome embodiments, section 102 c may be a conventional profiler orcircular saw module. Other embodiments may lack section 102 c.

First Saw Module

Referring again to FIG. 1, first saw module 104 may include one or moreband saws, circular saws, or gang saws, alone or in any suitablecombination. Examples of suitable saw modules include, but are notlimited to, shape/curve saws, shape/curve sawing gang saws, straightsawing gang saws, and single, dual, and quad band saw systems. In someembodiments, first saw module 104 may be a quad arbor saw that includescircular saw blades arrayed along upper and lower horizontal arbors(FIGS. 9A-B). Optionally, the quad arbor saw may have a pair of shiftingsaw carriages with a fixed bottom arbor and a tilting top arborconfigured to equalize the depth of cut among the saws on the arbors. Inother embodiments, first saw module 104 may be a quad band saw. Again,first saw module 104 may have any suitable configuration, and the numberand type of saws will vary among embodiments.

FIGS. 10-13 illustrate examples of primary breakdown systems thatinclude a precut module upstream and a first saw module arranged invarious configurations, in accordance with embodiments. In the exampleof FIG. 10, precut module 102 includes a section 102 a with paired chipheads 118 and a section 102 b with a profiler configured to profile anoutermost side board, and first saw module 104 includes a quad arborsaw. In the example of FIG. 11, precut module 102 includes a section 102a with paired chip heads or a profiler, and second and third sections102 b and 102 c with corresponding profiling heads, and first saw module104 includes a band saw. In the example of FIG. 12, precut module 102includes a section 102 a and a section 102 b, each with a correspondingprecut saw assembly that includes one or more circular saws, and firstsaw module 104 includes a quad arbor saw. In the example of FIG. 13,precut module 102 includes a section 102 a with paired chip heads 118and a section 102 b with one or more circular saws, and first saw module104 includes a quad arbor saw. These examples are provided merely by wayof illustration, and are not intended to be limiting. The skilledartisan in possession of the present disclosure will readily appreciatemany other substitutions, alternatives, arrangements, combinations, andconfigurations that are suggested by the descriptions and illustrationsof the specific examples disclosed herein.

Conveyors and Additional Saw Modules

Referring again to FIG. 1, conveyor 106/108 may include any suitabletype of conveyor. Examples include, but are not limited to, sharp chainconveyors, flighted chain conveyors, smooth chain/belt conveyors, drivenfeed rolls, and the like, alone or in any suitable combination.Optionally, conveyor 106 may be configured to raise, lower, skew, slew,and/or tilt a primary workpiece engaged by, or upstream of, precutmodule 102 and/or first saw module 104. Likewise, in some embodimentsconveyor 108 may be configured to raise, lower, skew, slew, and/or tilta cut product engaged by, or upstream of, second saw module 110. In someembodiments, conveyor 106 and/or conveyor(s) 108 may each independentlyinclude one, two, or more than two conveyors.

Second saw module 110 may be configured to make one or more longitudinalcuts in a workpiece. In some embodiments, second saw module 110 may be,or may include, an edger. The edger may be a gang edger, a shiftingedger, or any other suitable type of edger. Some processing lines mayhave more than one second saw module 110 (e.g., two edgers). Otherprocessing lines may have only one second saw module 110.

Third saw module 112 may include one or more band saws, circular saws,or gang saws, alone or in any suitable combination. In variousembodiments, third saw module 112 may be positioned downstream of thefirst saw module 104 and operable to saw cants into boards. Someembodiments may lack third saw module 112.

Fourth saw module 114 may be configured to make one or more transversecuts in a workpiece. In some embodiments, fourth saw module 112 may be atrimmer. Other embodiments may lack a fourth saw module 112. Any or allof conveyors 106/108, second saw module 108, third saw module 112,and/or fourth saw module 114 may be conventional machinery arranged inany suitable manner.

Scanner/Optimizer System

In various embodiments, scanner/optimizer system 116 may include acomputing device 116 b and/or a sensor 116 a (FIG. 1). Sensor 116 a andcomputing device 116 b may be integrated within a single device in someembodiments. In other embodiments, sensor 116 a and computing device 116b may be separate devices that are operatively coupled together.Similarly, computing device 116 b may include either a single device ormultiple devices, and sensor 116 a can include either a single sensor ormultiple sensors. Sensor 116 a may include one or more optical/vision,mechanical, electrical, electronic, photoelectric, capacitive,ultrasound, microwave: radio frequency, X-ray, acoustic/vibration,proximity, or other suitable sensor types, alone or in any combination.Sensor 116 a can include a non-contact sensor, a contact sensor, or somecombination thereof. In some embodiments sensor 116 a is, or includes, a3D scanner. Examples of suitable sensors 116 a include, but are notlimited to, cameras, time-of flight 3D laser scanners, triangulation 3Dscanners, and computed tomography (CT) scanners. In other embodiments,workpiece processing system 100 may lack scanner/optimizer system 116.

In various embodiments, scanner/optimizer system 116 may be operativelycoupled to precut module 102 and/or first saw module 104. Optionally,scanner/optimizer system 116 may also be operatively coupled to any orall of the other saw modules 108/112/114 and/or conveyors 106/108. Invarious embodiments, scanner/optimizer system 116 may be programmed toperform (or control other devices to perform) various operations of anyor all of the methods described herein. For example, scanner/optimizersystem 116 may be programmed to generate instructions for use by a PLCor other type of controller to set or adjust a speed or position ofprecut module 102, first saw module 104, second/third/fourth saw module111/113/114, conveyor 106/108, and/or one or more components thereof,such as cutting members or positioning members.

Scanner/optimizer system 116 may be configured to scan a workpiece anddetermine an optimized cut solution for the workpiece based at least onthe scan data. In some cases, it may be possible to implement a givencut solution according to any one of several groups of cut patterns toobtain the desired cut product(s) from a workpiece. Each group of cutpatterns may provide a unique combination of parameters that influencethroughput speed and/or wood volume recovery. Examples of suchparameters include, but are not limited to, a required depth of cut, thesequential order in which cuts are made, the type and sequential orderof the machine centers/cutting members designated to make the cuts, thenumber and/or dimensions of the intermediate/final cut products, and theshape of the intermediate cut products (e.g., straight-edged orwane-edged). Other parameters may also be considered in calculating, orin determining a value of, a cut solution or group of cut patterns.Examples include, but are not limited to, monetary value of the finalcut products, length of time required to reposition a cutting member forcutting a subsequent or preceding workpiece, the shape of theintermediate cut products (e.g., straight-edged or wane-edged), themaximum throughput speed of individual machine centers, predicted oractual current throughput speeds through individual machine centers,predicted or actual backlogs along the processing line, and cutsolutions or cut patterns of other workpieces further upstream.

The number of possible cut patterns for a given cut solution may dependat least in part on the number and types of machine centers availablefor use to implement the cut solution(s). There may also be alternativecut solutions for the workpiece, and corresponding groups of cutpatterns for each cut solution. Therefore, scanner/optimizer system 116may also be configured to calculate alternative cut solutions and tocalculate cut patterns based at least on the corresponding cutsolutions.

In some embodiments, scanner/optimizer system 116 may be configured tocalculate a single group of cut patterns based on a cut solution and oneor more parameters. For example, scanner/optimizer system 116 may beconfigured to calculate a group of cut patterns for a workpiece based atleast on a desired depth of cut at the first saw center 104, a desiredwood volume recovery, or a desired throughput speed/volume. Optionally,scanner/optimizer system 116 may be configured to calculate the group ofcut patterns based on two or more parameters.

Alternatively, scanner/optimizer 116 may be configured to calculatemultiple groups of cut patterns for a given cut solution, determine abenefit of one of the cut patterns relative to the other(s), and selectone of the groups of cut patterns for implementation based on thebenefit. For example, if the goal is to maximize throughput through thesaw center, determining the benefit may involve determining which of thegroups of cut patterns requires the smallest depth of cut at the sawcenter. The benefit may also be determined based on multiple parameters.For example, the groups of cut solutions may be assessed to determinewhich of the groups offers the greatest wood volume recovery for apredefined throughput speed, or the greatest throughput speed for apredefined wood volume recovery. Optionally, the scanner/optimizersystem 116 may be configured to rank the groups of cut patternsaccording to a combination of factors and select the highest or lowestranking group of cut patterns for implementation.

In various embodiments, scanner/optimizer system 116 may be configuredto cause the corresponding machine centers to implement thecalculated/selected group of cut patterns. For example,scanner/optimizer system 116 may be configured to control the machinecenters directly, and/or to generate and send the cut patterns and/orcommands to controllers (e.g., programmable logic controllers) thatcontrol the position, speed, and/or various operations of the machinecenters.

Example 1

Embodiments of the present disclosure may be implemented in a variety ofways in sawmills and other wood processing facilities. The followingdescribes, by way of explanation, various operations of a workpieceprocessing system with reference to FIGS. 1 and 14A-H. However, thepresent disclosure will suggest numerous alternatives and modificationsto the skilled artisan in addition to those that are explicitlydescribed, and the example is not intended to be limiting.

In this example, a workpiece processing system 100 includes a precutmodule 102, a first saw module 104 disposed downstream of the precutmodule 102, and at least a second saw module 108 disposed downstream ofthe first saw module 104. The second saw module 108 has at least oneedger. Precut module 102 includes a section 102 a with side chippers orsaws that are operable to open flat faces along the primary workpiece,and a section 102 b with profiling heads. Precut module 102 may or maynot include a section 102 c with profiling heads or circular saws. Theworkpiece processing system 100 also includes a scanner/optimizer system116 operatively coupled to the precut module 102, first saw module 104,and second saw module 108.

In operation, the primary workpiece is scanned by the scanner/optimizersystem 116 upstream of precut module 102 to obtain dimensional data andother information about the primary workpiece (e.g., the size andlocation of defects). The scanner/optimizer system 116 calculates atleast one cut solution for the primary workpiece based at least on thescan data. For example, FIG. 14A illustrates a cut solution 142 thatdefines predicted side boards 144 and center boards 146 to be cut fromthe primary workpiece along predicted cut lines (dashed lines of FIG.14A). The inner and outer faces of the predicted side boards 144 aredefined by predicted cut lines 150 and 148, respectively, and thelongitudinal sides of the predicted side boards are defined by predictedcut lines 154. While one possible cut solution is illustrated by way ofexplanation, in some embodiments scanner/optimizer system 116 maycalculate multiple cut solutions that define different predicted cutproducts. Optionally, scanner/optimizer system 116 may calculate the cutsolution(s) based at least in part on one or more defined parameters, asdiscussed herein.

Some predicted cut lines may define through-cuts through the primaryworkpiece (i.e., cuts that extend through two surfaces of the primaryworkpiece). In this example, predicted cut lines 148 and 150 definethrough-cuts through the primary workpiece. In some cases, a through-cutdefined by a predicted cut line may be one of several possible optionsfor implementing the predicted cut line. For example, as predicted cutline 150 extends through two opposite surfaces of the primary workpiece,it would typically be implemented by cutting through the primaryworkpiece. But predicted cut line 148 does not extend fully through theprimary workpiece. As such, it could be implemented by section 102 a asa through-cut through the primary workpiece (see FIG. 14B). Or, if theworkpiece processing system includes a reman head downstream of thefirst saw center 104, predicted cut line 148 could be implemented by thereman head instead of as a through-cut through the primary workpiece.Thus, a predicted cut line can define a through-cut through a particularworkpiece even if it could be implemented in some other manner.

The scanner/optimizer system 116 calculates at least one group of cutpatterns for implementing the cut solution. Again, the scanner/optimizersystem 116 may do this in any of several different ways—by calculating asingle group of cut patterns based on the cut solution and one or moreprofitability-related parameter(s), or by calculating multiple groups ofcut patterns for one or more corresponding cut solutions and selectingone of the groups for implementation (e.g., based on one or moreprofitability-related parameters). If multiple groups of cut patternsare calculated, each group may represent a different strategy and/or adifferent combination of machine centers for implementing a givenportion of the cut solution. The groups may, but need not, include cutpatterns that are common to all of the groups (i.e., those for which noalternatives are calculated).

In this example, scanner/optimizer system 116 calculates a cut patternfor implementation by first precut unit 102 a to open faces alongopposite sides of the workpiece and remove extraneous material 152 a(FIGS. 14A-B, cut lines 148) to form a cant.

The scanner/optimizer system 116 also calculates several groups of cutpatterns (Group A, Group B, and Group C) that represent differentstrategies for cutting the cant along the predicted cut lines (150 and154) to obtain the side boards. Each group of cut patterns is configuredfor implementation by a different combination of machine centers:

-   1. Group A (FIG. 14C): This group of cut patterns includes (1) a cut    pattern for implementation by first saw module 104 to cut the cant    along predicted cut lines 150, yielding two flitches and a center    cant; and (2) a cut pattern for implementation by second saw center    108 to cut the flitches along predicted cut lines 154, yielding two    side boards 144 and extraneous material 152 b.-   2. Group B (FIG. 14D): This group of cut patterns includes (1) a cut    pattern for implementation by second precut unit 102 b to cut the    cant along predicted cut lines 154 and portion 150 a of predicted    cut lines 150 and remove extraneous material 152 b, thereby forming    the profiles of the side boards 144; and (2) a cut pattern for    implementation by first saw module 104 to cut the workpiece along    the remaining portion 150 b of predicted cut lines 150 to release    the side boards 144 from the remaining center cant.-   3. Group C (FIG. 14E): This group of cut patterns includes (1) a cut    pattern for implementation by second precut unit 102 b to cut the    cant along cut lines 156 and portion 150 c of predicted cut lines    150 to remove extraneous material 152 c, thereby forming the    profiles of blocks 158 that are wider than the side boards 144; (2)    a cut pattern for implementation by first saw module 104 to cut the    workpiece along the remaining portion 150 d of predicted cut lines    150 to cut the blocks 158 from the workpiece; and (3) a cut pattern    for implementation by second saw center 108 to cut the blocks 158    along predicted cut lines 154, yielding two side boards 144 and    extraneous material 152 d.

As will be readily apparent to those skilled in the art, many otheralternatives may be possible depending in part on the configuration ofthe processing line. For example, if second saw center 108 includes areman head, a fourth group of cut patterns might include a cut patternfor implementation by first saw center 104 to cut slabs from theworkpiece along cut lines 150, a cut pattern for implementation bysecond saw center 108 to cut the slabs along predicted cut lines 154,and a cut pattern for implementation by the reman head to cut the slabsalong predicted cut lines 148. (In that case, Groups AC may include thecut pattern calculated for implementation by the first precut section102 a to open faces along the workpiece, and the fourth group of cutpatterns may not include that cut pattern.)

The scanner/optimizer system 116 determines a value of each group of cutpatterns in terms of wood volume recovery, throughput speed, and/or oneor more other parameters. For instance, if the edger can cut a sideboard with greater accuracy/precision than the profiler,scanner/optimizer system 116 may determine that Groups A and C havegreater values than Group B in terms of wood volume recovery. If theprofiler is faster than the edger, scanner/optimizer system 116 maydetermine that Groups B and C have greater values that Group A in termsof throughput. The scanner/optimizer system 116 may determine separatevalues for each of several factors, or determine a value based on oneparameter and adjust the value based on another parameter.

In some embodiments, scanner/optimizer system 116 may determine, foreach group of cut patterns, a corresponding throughput speed through agiven machine center or portion of the processing line. The machinecenter may have a range of depths of cut, and a known or predictedthroughput speed for each depth of cut within the range. Thus,throughput speed through the machine center may be predicted for a givencut pattern by determining the depth of cut required by that cut patternat that machine center and using the determined depth of cut to identifythe corresponding throughput speed for that machine center.

Scanner/optimizer system 116 may determine the depth of cut required bya cut pattern based at least on the cut solution, corresponding cutpattern(s), and/or dimensional information about the primary workpiece.In other cases, scanner/optimizer system 116 may determine the depth ofcut based on input from a human operator entered via a keyboard,touchscreen, or other type of interface.

In some cases, scanner/optimizer system 116 may determine the depths ofcut required at a particular machine center by two or more alternativecut patterns for that machine center. In this example, each of thegroups of cut patterns A, B, and C include a corresponding cut patternfor first saw module 104 that defines a cut to be implemented by firstsaw module 104 (see FIGS. 14C-E, predicted cut line 150 and portions 150b, 150 d). Thus, scanner/optimizer system 116 determines a depth (seearrows of FIGS. 14C-E) of each of these defined cuts.

Scanner/optimizer system 116 may use the determined depth of cut, andthe relationship between cut depth and speed for that machine center, topredict a throughput speed for the corresponding cut pattern or group ofcut patterns. The relationship may be particular to that saw module, orit may apply more generally to saw modules of a given type (e.g., bandsaw modules, gang saw modules, etc.). An example of such a relationshipis shown below in Table 1:

TABLE 1 Depth of cut (inches) Throughput speed (feet per minute) 10-12450  8-10 550 7-8 600 6-7 610 up to 6  620+

In some embodiments, such relationship information may be stored locallyon scanner/optimizer system 116 or stored externally (e.g., on a remotedatabase, cloud, etc.), as a look-up table or other suitable type ofrecord. Optionally, scanner/optimizer system 116 may be programmed tocreate or adjust the relationship information by monitoring operationsof the saw module (e.g., cutting member speed, cut depth, throughputspeed) in real time and associating the monitored parameters with oneanother. For example, scanner/optimizer system 116 may be programmed todetermine an actual throughput speed of first saw module 104 during anincrement of time, determine the actual depth of cut of first saw module104 during the same increment of time, store the two values inassociation with one another in the form of a look-up table or otherrecord, and retrieve the values at a later time (e.g., by searchingrecorded values for a particular throughput speed or depth of cut).

In any case, scanner/optimizer system 116 may use the relationshipinformation to identify the throughput speed that corresponds to thedetermined depth of cut for a given cut pattern. In this example,scanner/optimizer system 116 may determine that the depths of cut forpredicted cut lines 150 and portions 150 b and 150 d are 12 inches, 6inches, and 7 inches, respectively. Scanner/optimizer system 116 mayaccess the relationship information in Table 1 and use the determineddepths of cut to identify the corresponding throughput speeds. Thus,scanner/optimizer system 116 may determine that Groups A, B, and C havethroughput speeds of 450 fpm, 610 fpm, and 610 fpm, respectively,through first saw module 104. Predicted throughput speeds may bedetermined in a similar manner for other machine centers.

Optionally, each predicted throughput speed may be used to calculate, orto adjust, the value of the corresponding group of cut patterns. In someembodiments each predicted throughput speed may be expressed as a cost,or as a benefit. For example, the group of cut patterns with the fastestthroughput speed (e.g., through first saw module 104) may be assigned athroughput cost of zero, the group with the slowest throughput speed maybe assigned the highest throughput cost, and any other groups may beassigned throughput speeds between that value and zero. Optionally,scanner/optimizer system 116 may identify a desired cut depth for agiven saw module (e.g., first saw module 104) and eliminate or reducethe value of any group of cut patterns that requires a deeper cut atthat saw module. Alternatively, as explained further below in Example 2,scanner/optimizer system 116 may determine the depth of a predicted cutand a desired cut depth for a particular machine center, and calculatecut patterns based at least on those values.

Cut patterns for preceding/subsequent workpieces may also affectthroughput speed through the first saw module 104, and in someembodiments scanner/optimizer system 116 may consider them in theprocess of selecting, or assigning a value to, a group of cut patternsfor a particular workpiece. For example, if the cut patterns for severalconsecutive workpieces upstream of the workpiece also require cuts atthe edger, the value of Group B may be increased (or the value of GroupsA and C reduced) to reflect a predicted backlog or slowdown at theedger.

Optionally, scanner/optimizer system 116 may determine the value of agroup of cut patterns in monetary terms. Referring to the example above,if Group A is predicted to yield final cut products worth $420 at a costof $25 in terms of throughput, Group B is predicted to yield final cutproducts worth $400 at no cost in terms of throughput, and Group C ispredicted to yield final cut products worth $420 at no cost in terms ofthroughput, Group C may be selected as the most profitable group. But ifthe scanner/optimizer system 116 detects or predicts a slowdown at theedger and determines that the slowdown increases the cost of Group B to$25 in terms of throughput, scanner/optimizer system 116 may adjust thevalue of Group C and select Group B as the most profitable group. Thus,the most profitable option for a given workpiece is not necessarily theone that produces the most valuable final cut products or the greatestthroughput, but one that offers the best combination of costs andbenefits.

Example 2

The above Example described the use of the relationship betweenthroughput speed and cut depth to determine throughput speeds ofmultiple groups of cut patterns. In contrast, this Example describes theuse of cut depth and throughput speed to calculate a group of cutpatterns.

In this example, workpiece processing system 100 is configured generallyas described in Example 1, except that section 102 b of precut module102 includes circular saws 120 instead of profiling heads 136. However,the operations and methods described in these Examples are not limitedto the described configurations of workpiece processing system 100. Forinstance, multiple groups of cut patterns can be calculated and assessedfor profitability (e.g., based on throughput speed) as described inExample 1 whether section 102 b of the precut module has profilingheads, circular saws, or both. Likewise, a group of cut patterns can becalculated based on a desired cut depth for a given saw module whethersection 102 b of the precut module has profiling heads, circular saws,or both. Other modifications to the configuration and operations arereadily apparent to those skilled in the art and encompassed by thepresent disclosure.

In operation, the primary workpiece is scanned by the scanner/optimizersystem 116 upstream of precut module 102 to obtain the dimensions/shapeof the primary workpiece. The scanner/optimizer system 116 calculates atleast one cut solution for the primary workpiece based on the scan data.Referring again to FIG. 14A, in this example the cut solution 142 andpredicted cut products (side boards 144 and center boards 146) aregenerally as described in Example 1, and predicted cut lines 148 and 150define through-cuts through the primary workpiece.

Scanner/optimizer system 116 may identify a desired depth of cut ordesired processing speed for first saw center 104. In some embodimentsscanner/optimizer system 116 may determine the desired depth of cutand/or processing speed based on input from a human operator. Forexample, a human operator may use a keyboard, touchscreen, or other typeof interface to input the desired processing speed and/or throughputspeed.

Optionally, scanner/optimizer system 116 may be configured to determinethe desired depth of cut and/or processing speed based on one or moreparameters. Such parameters include, but are not limited to, a predictedthroughput speed of one or more other machine centers upstream ordownstream of first saw center 104, size of gaps between workpieces,time required to reposition circular saws 120 between workpieces, timerequired time to reposition saw(s) of first saw center 104 betweenworkpieces, positioning range of saws 120/saws of first saw center 104,physical characteristics of the workpieces (e.g., dimensions, species,hardness, moisture content), monetary factors (e.g., log cost, marketprice of predicted cut products), and mechanical constraints of firstsaw module 104 (e.g., the relationship between throughput speed anddepth of cut, maximum skew/slew angles, maximum saw speed, flexibilityof cutting members, lubrication/cooling requirements, and the like),alone or in any combination.

In some embodiments, scanner/optimizer system 116 may identify thedesired depth of cut or throughput speed based at least in part on arelationship between throughput speed and depth of cut, as describedabove with regard to Example 1. Again, information about therelationship may be stored on, or otherwise accessible to,scanner/optimizer system 116.

Scanner/optimizer system 116 may calculate at least one group of cutpatterns for the workpiece based on the cut solution and the desired cutdepth/speed. The cut solution may require a through-cut through theprimary workpiece. However, unlike conventional methods in which thethrough-cut would be made by a single saw module (see e.g., FIG. 14F,predicted cut line 150), scanner/optimizer system 116 may calculate thecut patterns in order to distribute the through-cut among two or moresaw modules.

In some embodiments, scanner/optimizer system 116 may determine adesired depth of cut for a given saw module and calculate a cut patternfor the saw module to implement a portion of the through-cut such thatthe saw module does not exceed the desired depth of cut.Scanner/optimizer 116 may calculate another cut pattern forimplementation by another saw module upstream or downstream of the givensaw module to implement the remaining portion of the through-cut.

In this example, a desired throughput speed of 600 feet per minute (fpm)through first saw module 104 is input by a human operator.Scanner/optimizer system 116 accesses information about the relationshipbetween cut depth and throughput speed for first saw module 104 (e.g.,Table 1) to identify the corresponding depth of cut, which is 6-7inches. Based at least on this desired depth of cut, scanner/optimizersystem 116 calculates a group of cut patterns to implement the cutsolution 142. Optionally, scanner/optimizer system 116 may alsodetermine a total depth of cut for predicted cut line 150 (FIG. 14F,double ended arrow).

Referring now to FIG. 14G, scanner/optimizer system 116 calculates afirst cut pattern for section 102 a of the precut module to open facesalong the primary workpiece (predicted cut line 148). Second and thirdcut patterns are calculated for implementation by section 102 b andfirst saw module 104, respectively, to cut the workpiece alongcorresponding portions 150 e and 150 f of predicted cut line 150. Afourth cut pattern is calculated for implementation by second saw center108 to cut the resulting flitch longitudinally along predicted cut lines154 into the predicted side board 144 and pieces of extraneous material152 b.

In some embodiments, scanner/optimizer system 116 may calculate thesecond/third cut pattern based on the difference between the desireddepth of cut at first saw module 104 and the total depth of thethrough-cut (FIG. 14F, double arrow). In some embodiments,scanner/optimizer system 116 may determine the difference by subtractingthe desired depth of cut from the total depth of the through-cut, anduse the difference as the depth of first portion 150 e of predicted cutline 150. Optionally, if a value is represented as a range (e.g., 6-7inches), the median of the range may be used as the value (e.g., 6.5inches). As an example, if the total depth of predicted cut line 150 is14 inches and the desired depth of cut for first saw center 104 is 6.5inches, scanner/optimizer system 116 may calculate the second cutpattern to give the first portion 150 e a depth of 7.5 inches, andcalculate the third cut pattern to give the second portion 150 f a depthof 6.5 inches.

Alternatively, scanner/optimizer system 116 may divide the total depthof the through-cut evenly among multiple saw modules by default, unlessdoing so would exceed the desired depth of cut at the corresponding sawmodule. For example, scanner/optimizer system 116 may divide the totaldepth of the through-cut by the number of saw modules and compare thedividend to the desired depth of cut. Scanner/optimizer 116 may chooseto divide the total depth of the through-cut evenly among the sawmodules if the dividend does not exceed the desired depth of cut, or iswithin a desired range of depths of cut, or if it otherwise falls withina predefined limits (e.g., within 5% of the desired value/range), or thelike. In this example, if the total depth of the through-cut is 14inches, scanner/optimizer system 116 may divide the total depth by two(i.e., for section 102 b and first saw center 104) and compare theremainder (7) with the desired depth of cut at first saw module 104 (6-7inches). Because the remainder does not exceed the desired range ofdepths, scanner/optimizer system 116 may calculate the second and thirdcut patterns to give both portions 105 e, 150 f of the through-cut thesame depth (7 inches). If the remainder does not fall within thepredefined limits, scanner/optimizer system 116 may determine that thetotal depth of cut cannot be distributed evenly among the saw modules,and calculate the second and third cut patterns to give portion 150 fthe desired depth of cut and portion 150 e the remaining depth of cut.

Alternatively, scanner/optimizer system 116 may calculate thesecond/third cut patterns in any other suitable manner. In addition,scanner/optimizer system 116 may calculate one or more alternativegroups of cut patterns in some embodiments. For example,scanner/optimizer 116 may calculate one group of cut patterns based onthe difference between the desired depth of cut at first saw module 104and the total depth of the through-cut, and a second group of cutpatterns in which the total depth of the through-cut is evenlydistributed among section 102 b and first saw module 104. In such cases,scanner/optimizer system 116 may evaluate the groups of cut patterns andselect one group for implementation based on profitability.

In other embodiments, the precut module may include a section 102 c withone or more additional circular saws 120. If so, the second and thirdsections 102 b, 102 c may be used to pre-cut the same workpiece ordifferent workpieces. For example, they may be used to pre-cut oppositesides of the same workpiece, or to pre-cut the same workpiece alongdifferent predicted cut lines, or to pre-cut the same workpiece alongthe same predicted cut line (e.g., by dividing the depth of the cutamong sections 102 b and 102 c and first saw module 104). Alternatively,the two sections may be used in an alternating manner to pre-cutdifferent workpieces, which may help to reduce gaps required forrepositioning the circular saws between successive workpieces.

Moreover, although this Example describes pre-cutting a workpiece withcircular saws, the skilled artisan will readily understand from thepresent disclosure that the same or similar methods and operations couldbe performed instead with profiling heads. Thus, in embodiments with aprecut module that has profiling heads instead of circular saws 120,scanner/optimizer system 116 may be configured to calculate cut patternsbased at least on parameters such as desired depth of cut at first sawmodule 104, the difference between the desired depth of cut and a totaldepth of a predicted cut, and the like, and to distribute the depth ofcut among the profiling heads and first saw module 104 in the same orsimilar manner.

Example 3

In some cases, a cut solution may define an inner side board and anarrower outer side board along one side of the primary workpiece.Various processing strategies may be used to cut the inner and outerside boards from the primary workpiece, depending in part on the numberof profiler units.

In this Example the shaded side boards 144 of FIG. 14A are consideredouter side boards, and the immediately adjacent center boards 146 areconsidered inner side boards. Workpiece processing system 100 has atleast one profiler unit (e.g., section 102 b), and may optionally have asecond profiler unit (e.g., section 102 c). Otherwise, the configurationand operations of workpiece processing system 100 and its components(e.g., scanner/optimizer 116) are generally as described in thepreceding Examples, unless stated otherwise.

Again, scanner/optimizer system 116 may calculate one group of cutpatterns based on a given parameter (e.g., desired cut depth orthroughput at a saw module) or calculate multiple groups of cut patternsand select one group for implementation based on a benefit of that group(e.g., in terms of throughput speed, wood volume recovery, etc.).

Two Profiler Units:

In embodiments with two profiler units (e.g., section 102 b and section102 c) upstream of the saw center, each profiler unit may be used toprofile a corresponding one of the side boards. Alternatively, one ofthe profiler units could be used to profile the corresponding sideboard, and the other could be used to profile a block that will be sentto the edger to obtain the other side board. As another alternative, theprofiler units could be used to profile two blocks that will be sent tothe edger to obtain the corresponding side boards. In any case, theouter side board or block could be severed with a first cut, and theinner side board or block could be severed from the remainder of theworkpiece with a second cut.

Thus, scanner/optimizer system 116 may calculate at least one group ofcut patterns that includes a cut pattern for the first profiler unit andanother cut pattern for the second profiler unit.

One possible group of cut patterns might include cut patterns forimplementation by the two profiler units, collectively, to cut theworkpiece along predicted cut lines 154 and 146 a (if profiling bothside boards). A second possible group of cut patterns might include cutpatterns for implementation by the two profiler units, collectively, tocut the workpiece along predicted cut lines 156 (FIG. 14E) and 146 a (ifprofiling the inner side board and a block for the outer side board). Athird possible group of cut patterns might include cut patterns forimplementation by the two profiler units, collectively, to cut theworkpiece along predicted cut lines 154 and an outermost portion ofpredicted cut line 146 c that stops short of predicted cut line 146 a(if profiling the outer side board and a block for the inner sideboard). A fourth possible group of cut patterns might include cutpatterns for implementation by the two profiler units, collectively, tocut the workpiece along predicted cut lines 156 and the outermostportion of predicted cut line 146 c (if profiling blocks for both theinner and outer side boards).

One Profiler Unit:

In other embodiments, the same side boards may be obtained without usinga second profiler unit. For example, a single profiler unit (e.g.,section 102 b) may be used to form the profile of a block that is atleast as wide as the inner side board and has the combined thickness ofboth side boards (adjusted for kerf, etc.). The outer portion of theblock may be severed with a first cut and sent to the edger in order toobtain the outer side board, and the inner portion of the block may besevered from the remainder of the workpiece with a second cut.

One option is to profile the block to substantially the same width asthe inner side board, such that the inner portion need not be sent tothe edger. Another option is to profile the block to a greater widththan the inner side board, and to send both the inner and outer portionsto the edger to obtain the corresponding side boards.

Thus, the scanner/optimizer system 116 may calculate one or more groupsof cut patterns. Each group may include a corresponding cut pattern forthe profiler unit. One possible group of cut patterns might include acut pattern for implementation by the profiler unit to cut the workpiecealong predicted cut lines 146 a to the intersections of those cut lineswith predicted cut lines 146 c (FIG. 14A), or vice versa (if profiling ablock the same width as the inner side board). Another possible group ofcut patterns might include a cut pattern for implementation by theprofiler unit to cut the workpiece along the outermost portions ofpredicted cut lines 146 c, stopping short of predicted cut line 146 a(if profiling a block that is wider than the inner side board).Alternatively, if the single profiler unit is provided with steppedprofiling heads it may be used to profile one or both of the sideboards.

Scanner/optimizer system may also calculate corresponding cut patternsfor other machine centers, such as section 102 a, first saw module 104,and/or second saw module 108. For example, the group(s) of cut patternsmay include a cut pattern for implementation by first saw module 104 tomake the first and second cuts. Alternatively, the group(s) of cutpatterns may include a cut pattern for implementation by first sawmodule 104 to make one of the cuts, and another cut pattern forimplementation by another saw module to make the other cut (e.g., secondsaw module 108, or an additional section of the precut module with atleast one circular saw). Optionally, one or both of the cuts required tosever the inner and outer portions of the blocks may be made partiallyby one saw module and partially by another saw module. For example, afirst portion of the cuts may be made by an additional section of theprecut module with at least one circular saw, and the remainder of thecuts may be made by first saw module 104 and/or third saw module 112.

Example 4

Profiling both profiling heads and circular saws upstream of the sawmodule may increase the number of options for implementing a given cutsolution. In this Example, workpiece processing system 100 is configuredgenerally as described in Example 1, except that section 102 b of precutmodule 102 includes profiling heads 136, and a section 102 c of precutmodule 102 includes circular saws 120. Otherwise, the configuration andoperations of workpiece processing system 100 and its components (e.g.,scanner/optimizer 116) are generally as described in the precedingExamples, unless stated otherwise.

Scanner/optimizer system 116 calculates a cut solution for a primaryworkpiece. Scanner/optimizer system 116 also calculates cut patterns forthe workpiece based on the cut solution. Optionally, scanner/optimizersystem 100 may also identify a desired depth of cut for a saw module(e.g., first saw module 104) and the depth of cut required to implementa predicted cut line (e.g., predicted cut line 150). The values may beidentified or determined generally as described in the precedingExamples, or by any other suitable method. Again, the cut solutionand/or cut patterns may be calculated based at least in part on thedesired depth of cut, throughput speed, and/or other factors asdescribed above.

However, in this example the configuration of workpiece processingsystem 100 allows the through-cut to be distributed among threemachines—a profiler unit (section 102 b), a presaw unit (section 102 c),and a saw module (first saw module 104). Therefore, scanner/optimizersystem 116 may calculate a group of cut patterns that includes cutpatterns for each of section 102 b, section 102 c, first saw module 104,and second saw module 108 (e.g., an edger).

Scanner/optimizer system 116 may calculate the cut patterns todistribute the total depth of the through-cut among the profiler unit,presaw unit, and saw module. As shown for example in FIG. 14H, the cutpatterns for each of section 102 b, section 102 c, and first saw module104 may define corresponding portions 150 g, 150 e, and 150 f,respectively, of predicted cut line 150. The cut pattern for section 102b may define the profile of a block 158 to be formed along the workpieceby removing extraneous material 152 c. The block may be severed from theremainder of the workpiece by section 102 c and first saw center 104,and cut into the desired cut product (side board 144) and other pieces(extraneous material 152 d) by second saw center 108, according to thecorresponding cut patterns.

Scanner/optimizer system 116 may distribute the depth of cut among theprofiler unit, presaw unit, and saw module in the same or similar manneras described in the preceding Examples. For instance, the cut patternsmay be calculated to distribute the depth of cut evenly among all of themachines, or to give a desired depth of cut to a particular machine.

Optionally, scanner/optimizer system 116 may calculate multiple groupsof cut patterns and select one group for implementation, as generallydescribed in any or all of the preceding Examples. For instance,scanner/optimizer system 116 may calculate any or all of the cutpatterns described in Examples 1-3 and illustrated in FIGS. 14B-H. Eachgroup of cut patterns may be configured for implementation by adifferent combination of machine centers. One group might include cutpatterns for section 102 b and first saw center 104, but not for secondsaw center 108 (e.g., to profile the side board as in FIG. 14D). Anothergroup might include cut patterns for section 102 b, first saw center104, and second saw center 108, but not for section 102 c (e.g., toprofile and cut a block as in FIG. 14E, without using section 102 c).Yet another group might include cut patterns for section 102 c, firstsaw center 104, and second saw center 108, but not for section 102 b(e.g., to pre-cut a flitch and cut the side board from the flitch as inFIG. 14G).

Scanner/optimizer system 116 may assess the groups of cut patterns andselect one group for implementation based on one or more parameters, inthe same or similar manner as described in the preceding Examples.

Methods

Embodiments of methods described herein may provide increases inthroughput and/or wood volume recovery over prior processing methods.For example, profiling a block along a primary workpiece and sending theblock to the edger may allow throughput speed through the saw to bemaintained or increased. The straight-edged block may also be positionedmore quickly and accurately at the edger than a corresponding flitch,which may further increase throughput at little or no cost to woodvolume recovery.

FIGS. 15-18 are flow diagrams that illustrate embodiments of suchmethods, described further below. For clarity, the term “block” iscapitalized and followed by the corresponding block number (“Block XXX”)when used below in reference to operations of the flow diagrams.Otherwise, the term “block” is used in reference to a particular type ofcut product as defined above (e.g., generally opposite machined faces,at least one longitudinal side machined along all or part of its length,and wider than the corresponding final cut product). While the Blocksare shown in a particular order by way of example, it is to beunderstood that in various embodiments the correspondingactions/processes may be performed in any order and/or any suitablenumber of times. Therefore, the order and number of actions/processes isnot intended to be limiting.

FIG. 15 illustrates a flow chart of a method 200 for processing aworkpiece to obtain a desired cut product. In various embodiments,method 200 may involve profiling a block along the workpiece and cuttingthe desired cut product from the block. This may allow greater woodvolume recovery and/or throughput than conventional methods that involveprofiling the desired cut product or cutting the desired cut productfrom a flitch. In some embodiments, various operations of method 200 maybe as described in Examples 1-4.

Optionally, method 200 may begin at Block 201 by defining a desired cutproduct to be cut from a workpiece. Optionally, the desired cut productmay be a side board. In some embodiments, the desired cut product may bedefined by calculating a cut solution (e.g., an optimized cut solution)for the workpiece. In other embodiments, the desired cut product may bedefined by a human operator (e.g., by inputting desired cut productsand/or dimensions to scanner/optimizer system 116). Optionally, thedesired cut product may be defined by both scanner/optimizer system 116and a human operator. For example, scanner/optimizer system 116 maycalculate an optimized cut solution, and the human operator may provideinput to approve or override the optimized cut solution in favor of asecond cut solution or a user-defined set of criteria.

Optionally, Block 201 may be performed once for a series of workpiecesor omitted altogether. For example, processing lines that are used tocut logs or cants of a very consistent size and shape, and/or very shortlogs or cants, may be configured to cut all workpieces in the samemanner to yield the same cut products. In such cases, the desired cutproduct may be pre-defined and Block 201 unnecessary. Therefore, method200 may begin at Block 203 in some embodiments.

At Block 203, a first cut pattern configured for implementation by aprofiler module upstream of a saw module may be calculated. The firstcut pattern may define a profile of a block to be formed along a firstside of the workpiece, and the block may be wider than the desired cutproduct. In some embodiments, the first cut pattern may be configuredfor implementation by a profiler unit (e.g., section 102 b of precutmodule 102) disposed upstream of a saw module (e.g., saw module 104).

Optionally, Block 203 may further include calculating an alternative cutpattern configured for implementation by the profiler unit, determiningthat the first cut pattern is more profitable than the alternative cutpattern, and sending the first cut pattern to the profiler module basedon that determination. For example, the alternative cut pattern maydefine a profile of the desired cut product to be formed along theworkpiece. Profitability may be assessed based on one or more parametersrelated to profitability, such as throughput, wood volume recovery, orthe like, as described above.

A second cut pattern configured for implementation by an edgerdownstream of the saw module may be calculated at Block 205. In variousembodiments, the first and second cut patterns may be calculated by acomputer system (e.g., scanner/optimizer system 116) operatively coupledwith the precut module and/or the edger (e.g., second saw module 108).Alternatively, some embodiments may lack a computer system configured tocalculate the cut patterns, or may use a single cut pattern for multipleworkpiece, and the method may begin at Block 207.

At Block 207, the profile of the block may be formed along a first sideof the workpiece by the profiler unit. Optionally, at Block 207 thecomputer system may determine a benefit of the first cut patternrelative to the alternative cut pattern (e.g., determine that the firstcut pattern is more profitable than the alternative cut pattern) andselect the first cut pattern for implementation based on the benefit.

At Block 209, the block may be severed from a remaining portion of theworkpiece by the saw module downstream of the precut module. In someembodiments, a cut pattern for the saw module may be calculated at Block203, 205, or 209.

At Block 211, the block may be cut longitudinally into at least a firstpiece and a second piece by the edger according to the second cutpattern. The first piece may correspond to the desired cut product, andmay have substantially the same width as the desired cut product. Insome embodiments, the desired cut product may be an output of the edgerthat requires trimming, splitting, or other processing to obtain a finalcut product. In any case, if the first piece has substantially thewidth, length, and thickness of the desired cut product, the method mayend at Block 211.

Alternatively, the desired cut product may be a final cut product, andthe first piece may be an intermediate cut product to which one or moreadditional cuts must be made in order to obtain the desired cut product.In some embodiments the first piece may be longer/thicker than thedesired cut product, and the method may proceed to Block 213.

At Block 213, the first piece may be cut transversely to a longitudinalaxis of the first piece (i.e., trimmed) or cut along a plane that isgenerally parallel to the faces of the first piece (i.e., split) inorder to obtain the desired cut product. The cut(s) may be made by atrimmer, a splitter saw, or both. As an example, the desired cut productmay be a side board, and the first piece may be trimmed by a trim sawand/or split by a splitter saw to yield the side board and one or moreother pieces.

Optionally, method 200 may further include forming the profile of asecond desired cut product, or a block that is wider than the seconddesired cut product, along the same or different side of the workpiece.For example, the first and second desired cut products may be inner andouter side boards. In some embodiments, one group of cut patterns may becalculated based on a cut solution and/or one or more other parameters.Alternatively, multiple groups of cut patterns may be calculated and onegroup may be selected based on the parameter(s). For example, where twodesired cut products are inner and outer side boards, the computersystem may determine whether it is most profitable to profile both sideboards along the primary workpiece, to profile two blocks and send themboth to the edger to obtain the side boards, or to profile one sideboard and one block.

FIG. 16 illustrates a method 300 of processing a workpiece, inaccordance with various embodiments. In various embodiments, method 300may involve calculating at least two groups of cut patterns andselecting one of the groups for implementation based on profitability.In some embodiments, various operations of method 300 may be asdescribed in Examples 1-4.

At Block 301, a primary workpiece may be scanned upstream of a precutmodule (e.g., precut module 102). In some embodiments, the primaryworkpiece may be scanned by a scanner (e.g., sensor 116 a) operativelycoupled to a computer system (e.g., computing device 116 b). Optionally,the scanner and computer system may collectively form a scanning andoptimization system such as scanner/optimizer system 116.

Optionally, at Block 303, a cut solution (e.g., cut solution 142 of FIG.14A) may be calculated for the primary workpiece based at least on thescan data. The cut solution may define a group of predicted cut products(e.g., predicted cut products 144, 146 of FIG. 14A) and correspondingpredicted cut lines (e.g., dashed lines of FIG. 14A). Optionally, atleast one of the predicted cut lines may define a through-cut throughthe primary workpiece. In some cases, the through-cut may extend betweenadjacent predicted cut products (e.g., between a side board and a centerboard/cant, inner and outer side boards, or two center boards).

In some embodiments, the primary workpiece may be scanned and/or the cutsolution calculated before the primary workpiece arrives at theprocessing facility. Thus, some embodiments may lack Block 301 and/orBlock 303.

At Block 305 a first group of cut patterns may be calculated for theprimary workpiece. The first group of cut patterns may be configured tobe implemented by at least a saw module (e.g., first saw module 104) andan edger (e.g., second saw module 108). For example, the first group ofcut patterns may include a cut pattern for the saw module and a cutpattern for the edger. Optionally, the first group of cut patterns mayfurther include one or more additional cut patterns for another deviceor machine center.

At Block 307 a second group of cut patterns may be calculated for theprimary workpiece. The second group of cut patterns may be configured tobe implemented by at least a precut module (e.g., precut module 102) andthe saw module. For example, the second group of cut patterns mayinclude a cut pattern for the precut module and a cut pattern for thesaw module. Optionally, the second group of cut patterns may furtherinclude one or more additional cut patterns for another device ormachine center.

Optionally, at Block 309 a third group of cut patterns may be calculatedfor the primary workpiece. The third group of cut patterns may beconfigured to be implemented by at least the precut module, the sawmodule, and the edger. For example, the third group of cut patterns mayinclude a cut pattern for the precut module, a cut pattern for the sawmodule, and a cut pattern for the edger. Any or all of the groups of cutpatterns may further include one or more additional cut patterns foranother device or machine center. Other embodiments may lack Block 309.

A predicted benefit of one of the groups of cut patterns relative to theother group(s) of cut patterns may be determined at Block 311. In someembodiments, determining the predicted benefit may involve determining avalue for each calculated group of cut patterns based on one or moreparameters that relate to profitability (e.g., predicted throughputspeed/volume, predicted wood volume recovery). The values may becompared to identify the most profitable group of cut patterns.

At Block 313 one of the groups of cut patterns may be selected forimplementation based at least on the predicted benefit. For example, thegroup of cut patterns determined to be the most profitable in terms ofwood volume recovery and/or throughput may be selected forimplementation.

At Block 315 the cut patterns of the selected group may be sent to thecorresponding machine centers. At Block 317 the corresponding machinecenters may be controlled to cut the primary workpiece according to theselected group of cut patterns.

FIG. 17 illustrates a method 400 of processing a workpiece, inaccordance with various embodiments. In various embodiments, method 400may involve calculating one or more groups of cut patterns based atleast on a desired depth of cut for a given machine center, such as asaw module. This may allow the depth of a required cut to be distributedamong multiple machine centers for greater throughput speed. In someembodiments, various operations of method 400 may be as described inExamples 1-4.

At Block 401, a cut solution may be calculated for a primary workpiece.The cut solution may define a group of predicted cut products (e.g.,predicted cut products 144, 146 of FIG. 14A) and corresponding predictedcut lines (e.g., dashed lines of FIG. 14A). Optionally, one or more ofthe predicted cut lines may define a through-cut through the primaryworkpiece. In some embodiments, the primary workpiece may be scannedand/or the cut solution calculated before the primary workpiece arrivesat the processing facility. Thus, some embodiments may lack Block 401.

At Block 403 a desired depth of cut may be identified for a saw module(e.g., first saw module 104). The desired depth of cut may correspond toa throughput speed for that saw module. In some embodiments, the sawmodule may have a range of cut depths and each cut depth may have acorresponding throughput speed, and the desired depth of cut may bedetermined based at least on that relationship. Alternatively, thedesired depth of cut may be identified based on operator input, acurrent throughput speed, a current cut depth, or the like.

At Block 405 a first group of cut patterns may be calculated for theprimary workpiece based at least on the desired depth of cut. The firstgroup of cut patterns may define first and second portions of athrough-cut through the primary workpiece. In some embodiments, the cutsolution may define the through-cut as a predicted cut line (e.g.,predicted cut line 150), and the first and second portions of thethrough-cut may be portions of the predicted cut line to be cut bycorresponding machine centers. For example, the first group of cutpatterns may include a first cut pattern for a profiler or presaw unit(e.g., second section 102 a) of a precut module (102) upstream of thesaw module, and a second cut pattern for the saw module. The first cutpattern may define the first portion of the through-cut and the secondcut pattern may define the second portion of the through-cut. The secondportion of the through-cut may have a depth that is less than, or equalto, the desired depth of cut for the saw module.

In some embodiments, method 400 may proceed from Block 405 to Block 413.

In other embodiments, method 400 may proceed from Block 405 to Block407. At Block 407 a second group of cut patterns may be calculated forthe primary workpiece based on the same or different cut solution.Optionally, the second group of cut patterns may be configured todistribute the depth of the through-cut differently than the first groupof cut patterns. For example, one of the groups of cut patterns may beconfigured to distribute the depth of the through-cut substantiallyequally among the saw module and one or more profiler or presaw units,and another of the groups of cut patterns may be configured todistribute the depth of the through-cut such that the second portion ofthe through-cut is approximately equal to the desired depth of cut forthe saw module.

At Block 409 a predicted benefit of the first group of cut patterns maybe determined relative to the second group of cut patterns. In someembodiments, determining the predicted benefit may involve determining avalue for each group of cut patterns based on one or more parametersthat relate to profitability (e.g., predicted throughput speed/volume,predicted wood volume recovery). The values may be compared to identifythe most profitable group of cut patterns.

At Block 411 the first group of cut patterns may be selected forimplementation based at least on the predicted benefit. For example, thefirst group of cut patterns may be selected as the most profitable groupof cut patterns in terms of wood volume recovery and/or throughput.

At Block 413 a precut module (e.g., precut module 413) may be used tocut the workpiece along the first portion of the predicted through-cut.The first portion of the through-cut may extend only partially throughthe workpiece.

At Block 415 the saw module may be used to cut the workpiece along thesecond portion of the through-cut. This may complete the through-cut,severing the workpiece into at least a first piece and a second piece.In some embodiments, one of the pieces may be a flitch. In otherembodiments, one of the pieces may be a block that is wider than thedesired cut product.

At Block 417 an edger downstream of the saw module may be used to cutone of the pieces (e.g., the flitch or block) longitudinally into atleast a third and a fourth piece according to the first group of cutpatterns. In some embodiments, the third or fourth piece may be thedesired cut product. In other embodiments, method 400 may furtherinclude cutting the third or fourth piece into the cut product and oneor more additional pieces (e.g., with a trimmer saw and/or a splittersaw).

FIG. 18 illustrates a method 500 of processing a workpiece, inaccordance with various embodiments. In various embodiments, method 500may be used to obtain a pair of side boards by profiling a block thatcorresponds to both side boards, cutting inner and outer portions of theblock from the remaining portion of the workpiece, and cutting the outerportion of the block to obtain the outer side board. In someembodiments, various operations of method 500 may be as described inExamples 1-4.

At Block 501, a cut solution (e.g., cut solution 142 of FIG. 14A) may becalculated for a primary workpiece. The cut solution may define innerand outer side boards (e.g., adjacent boards 144 and 146 of FIG. 14A) tobe cut from one side of the primary workpiece. The cut solution may alsodefine corresponding predicted cut lines (e.g., dashed lines of FIG.14A).

At Block 503 a first group of cut patterns may be calculated based atleast on the cut solution. The first group of cut patterns may definethe profile of a first block to be formed along the primary workpiece byone or more profiler units (e.g., section 102 b of precut module 102).The profile of the first block may be at least as wide as the inner sideboard (e.g., side board 144 of FIG. 14A) and substantially as thick asthe inner and outer side boards in combination. For example, if theinner side board is 12 inches wide and 2 inches thick, and the outerside board is 6 inches wide and 2 inches thick, the profile of the firstblock may be at least 12 inches wide and 4 inches thick. In someembodiments, the profile of the first block may be substantially thesame width as the inner side board. In other embodiments, the profile ofthe first block may be wider than the inner side board. In someembodiments, the method may proceed from Block 503 to Block 511.

In other embodiments, the method may proceed from Block 503 to Block511. At Block 505 a second group of cut patterns may be calculated forthe primary workpiece based on the same or different cut solution. Thesecond group of cut patterns may define a profile of the outer sideboard to be formed along the workpiece. Alternatively, the second groupof cut patterns may define the profile of a second block ofsubstantially the same thickness, but different width, than the firstblock. For example, the first block may be of substantially the samewidth as the inner side board and the second block may be of greaterwidth than the inner side board, or vice versa.

A predicted benefit of the first group of cut patterns relative to theother group(s) of cut patterns may be determined at Block 507. In someembodiments, determining the predicted benefit may involve determining avalue for each calculated group of cut patterns based on one or moreparameters that relate to profitability (e.g., predicted throughputspeed/volume, predicted wood volume recovery). The values may becompared to identify the most profitable group of cut patterns.

At Block 509 the first group of cut patterns may be selected forimplementation based at least on the predicted benefit.

At Block 511 the profile of the first block may be formed along theprimary workpiece by the one or more profiler units according to thefirst group of cut patterns.

At block 513 one or more saws (e.g., first saw module 104) may be usedto sever an outer portion of the block and an inner portion of the blockfrom the remaining portion of the primary workpiece. The outer portionof the block may correspond to the outer side board, and the innerportion of the block may correspond to the inner side board. The cutsrequired to sever the inner and outer portions of the block may be madeby one saw module or by multiple saw modules.

At Block 515 the outer portion of the first block may be cutlongitudinally (e.g., by an edger) into pieces, at least one of whichcorresponds to the outer side board.

Optionally, at Block 517, the inner portion of the first block may becut longitudinally into additional pieces, at least one of whichcorresponds to the inner side board. In other embodiments, the firstblock may have substantially the same width as the inner side board,such that the inner portion of the first block requires no additionallongitudinal cuts to produce the inner side board. Thus, someembodiments may lack Block 517.

FIG. 19 illustrates an example of a computer system 600 suitable forpracticing embodiments of the present disclosure. In variousembodiments, computer system 600 may have some or all of the featuresdescribed herein with regard to scanner/optimizer system 116, and/orcomputing device 116 b. Again, while components of computer system 600are shown in a particular arrangement by way of example, it is to beunderstood that the arrangement and number of components may vary amongembodiments. Therefore, the arrangement and number of components, aswell as their corresponding actions/processes, is not intended to belimiting.

As illustrated, computer system 600 may include system control logic 608coupled to at least one of the processor(s) 604, memory 612 coupled tosystem control logic 608, non-volatile memory (NVM)/storage 616 coupledto system control logic 608, and one or more communications interface(s)620 coupled to system control logic 608. In various embodiments, systemcontrol logic 608 may be operatively coupled with sensor(s) 116 a and/oran output device such as a monitor, speaker, projector, or other suchdevice. In various embodiments the processor(s) 604 may be a processorcore.

System control logic 608 may include any suitable interfacecontroller(s) to provide for any suitable interface to at least one ofthe processor(s) 604 and/or any suitable device or component incommunication with system control logic 608. System control logic 608may also interoperate with the sensor 116 a and/or the output device. Insome embodiments, the output device may include a programmable logiccontroller (PLC) operatively coupled to one or more machine centers(e.g., precut module 102, first saw module 104, second saw module 108)and/or component(s) thereof.

System control logic 608 may include one or more memory controller(s) toprovide an interface to memory 612. Memory 612 may be used to load andstore data and/or instructions, for example, for various operations ofworkpiece processing system 100. For instance, in some embodimentsmemory 612 may store relationship information for first saw module 104(e.g., depths of cut and corresponding throughput speeds). In oneembodiment system memory 612 may include any suitable volatile memory,such as suitable dynamic random access memory (“DRAM”).

In various embodiments, system control logic 608 may include one or moreinput/output (“I/O”) controller(s) to provide an interface toNVM/storage 616 and communications interface(s) 620.

NVM/storage 616 may be used to store data and/or instructions, forexample. NVM/storage 616 may include any suitable non-volatile memory,such as flash memory, for example, and/or any suitable non-volatilestorage device(s), such as one or more hard disk drive(s) (“HDD(s)”),solid-state drive(s), compact disc (“CD”) drive(s), and/or digitalversatile disc (“DVD”) drive(s).

The NVM/storage 616 may include a storage resource that may physicallybe a part of a device on which computer system 600 is installed, or itmay be accessible by, but not necessarily a part of, such device. Forexample, the NVM/storage 616 may be accessed over a network via thecommunications interface(s) 620.

System memory 612, NVM/storage 616, and/or system control logic 608 mayinclude, in particular, temporal and persistent copies of applicationlogic 624. The application logic 624 may include instructions operable,upon execution by at least one of the processor(s) 604, to causecomputer system 600 to practice one or more aspects of operationsdescribed herein (e.g., calculation of cut solutions, calculation of cutpatterns, identification of desired cut depth or desired throughputspeed, determination of benefits or values of groups of cut patterns,selection of a group of cut patterns, implementation of the selectedgroup of cut patterns, etc.).

Optionally, computer system 600 may include sensor 116 a coupled withsystem control logic 608. Sensor 116 a may include sensor logic 634.Sensor logic 634 may include instructions operable, upon execution by atleast one of the processor(s) 604, to cause computer system 600 topractice one or more aspects of the processes described herein (e.g.,scanning a workpiece, generation of sensor data, creation of adimensional model of the workpiece based on sensor data, etc.).

Communications interface(s) 620 may provide an interface for computersystem 600 to communicate over one or more network(s) and/or with anyother suitable device. Communications interface(s) 620 may include anysuitable hardware and/or firmware, such as a network adapter, one ormore antennas, a wireless interface, and so forth. In variousembodiments, communication interface(s) 620 may include an interface forcomputer system 600 to use NFC, optical communications (e.g., barcodes),BlueTooth or other similar technologies to communicate directly (e.g.,without an intermediary) with another device. In various embodiments,the wireless interface may interoperate with radio communicationstechnologies such as, for example, WCDMA, GSM, LTE, and the like.

The capabilities and/or performance characteristics of processors 604,memory 612, and so forth may vary. In various embodiments, computersystem 600 may include, but is not limited to, a smart phone, acomputing tablet, a laptop computer, a desktop computer, and/or aserver. In various embodiments computer system 600 may be, but is notlimited to, one or more servers known in the art.

In one embodiment, at least one of the processor(s) 604 may be packagedtogether with system control logic 608 and/or application logic 624. Forexample, at least one of the processor(s) 604 may be packaged togetherwith system control logic 608 and/or application logic 624 to form aSystem in Package (“SiP”). In another embodiment, at least one of theprocessor(s) 604 may be integrated on the same die with system controllogic 608 and/or application logic 624. For example, at least one of theprocessor(s) 604 may be integrated on the same die with system controllogic 608 and/or application logic 624 to form a System on Chip (“SoC”).

Although certain embodiments have been illustrated and described herein,it will be appreciated by those of ordinary skill in the art that a widevariety of alternate and/or equivalent embodiments or implementationscalculated to achieve the same purposes may be substituted for theembodiments shown and described without departing from the scope. Thosewith skill in the art will readily appreciate that embodiments may beimplemented in a very wide variety of ways. This application is intendedto cover any adaptations or variations of the embodiments discussedherein. Therefore, it is manifestly intended that embodiments be limitedonly by the claims and the equivalents thereof.

What is claimed is:
 1. A method of processing a workpiece to obtain adesired cut product, wherein the workpiece is a log or a cant, and thedesired cut product is a side board that has opposite faces, oppositelongitudinal sides, and opposite ends, the method comprising: using oneor more first cutting members of a precut module to cut the workpiecelongitudinally along a first plane, such that the cut extends onlypartially through the thickness of the workpiece within the first plane;using one or more saws of a first saw module positioned downstream ofthe precut module to cut the workpiece longitudinally along the firstplane to thereby sever an intermediate cut product from a remainingportion of the workpiece, such that the precut module and the first sawmodule make corresponding first and second portions of a through-cutthrough the workpiece along the first plane, wherein the intermediatecut product has a width that is greater than the width of the desiredcut product; and using an edger positioned downstream of the first sawmodule to cut the intermediate cut product longitudinally into at leasta first piece and a waste piece, wherein the waste piece includes atleast a portion of a longitudinal side of the intermediate cut product,and wherein the first piece corresponds to the desired cut product,wherein the one or more first cutting members is one or more circularsaws or profiling heads, and wherein the method further includesdetermining a desired depth of cut for the first saw module based atleast on a desired throughput speed through the first saw module, anddetermining the first portion or the second portion of the through-cutbased at least on said desired depth of cut, wherein the second portionof the through-cut is less than or equal to the desired depth of cut. 2.The method of claim 1, wherein the one or more first cutting members isone or more circular saws.
 3. The method of claim 1, wherein the precutmodule includes a profiler, the one or more first cutting members is oneor more profiling heads of the profiler, and the intermediate workpieceis a block.
 4. The method of claim 3, further including determining orselecting a cut solution for the workpiece, wherein the cut solutiondefines the desired cut product.
 5. The method of claim 4, furtherincluding calculating, based at least on the cut solution, a first cutpattern configured to be implemented by the profiler, wherein the firstcut pattern defines the longitudinal sides of the block.
 6. The methodof claim 5, further comprising: determining a second cut patternconfigured to be implemented by the profiler or the edger, wherein thesecond cut pattern defines the longitudinal sides of the desired cutproduct; determining a first difference, if any, in wood volume recoveryfor the first cut pattern relative to the second cut pattern;determining a second difference, if any, in throughput for the secondcut pattern relative to the first cut pattern; comparing a value of thefirst difference to a value of the second difference; and sending thefirst cut pattern to the profiler based on said comparing.
 7. The methodof claim 5, further including calculating an increase in wood volumerecovery or a decrease, if any, in throughput speed through the firstsaw module for the first cut pattern relative to the second cut pattern.8. The method of claim 5, wherein the cut solution further defines asecond desired cut product, and wherein the precut module furtherincludes a second profiler, the method further comprising determining asecond cut pattern configured for implementation by the second profiler,wherein the second cut pattern defines the longitudinal sides of thesecond desired cut product or the longitudinal sides of a second blockthat is wider than the second desired cut product.
 9. The method ofclaim 5, wherein the first saw module includes one or more saws, thedesired depth of cut is a desired depth of cut for the one or more saws,and calculating the first cut pattern includes comparing a total depthof the through-cut to the desired depth of cut.
 10. The method of claim9, further including calculating a second cut pattern configured forimplementation by the first saw module, wherein the first cut patterndefines the first portion of the through-cut and the second cut patterndefines the second portion of the through-cut, and the second portionhas a depth that is less than or substantially equal to the desireddepth of cut for the one or more saws.
 11. The method of claim 10,wherein the one or more profiling heads includes at least a first and asecond profiling head, the first portion of the through-cut includesopposite ends of the through-cut, and the second portion of thethrough-cut is between said opposite ends of the through-cut.
 12. Themethod of claim 1, further including: using one or more second cuttingmembers of the precut module to cut the workpiece longitudinally along asecond plane, such that the cut made by the one or more second cuttingmembers extends only partially through the thickness of the workpiecewithin the second plane; using another one or more saws of the first sawmodule to cut the workpiece along the second plane to thereby sever asecond intermediate cut product from the remaining portion of theworkpiece; and using the edger to cut the second intermediate cutproduct longitudinally into at least a second side board and one or moreadditional pieces.
 13. The method of claim 12, wherein the one or morefirst cutting members and the one or more second cutting members areprofiling heads and the intermediate cut products are blocks, or whereinthe first one or more cutting members and the second one or more cuttingmembers are circular saws and the intermediate cut products areflitches, or wherein the first one or more cutting members are profilingheads and the first intermediate cut product is a block, and the secondone or more cutting members are circular saws and the secondintermediate cut product is a flitch.
 14. The method of claim 1, whereinthe one or more first cutting members is a first pair of profilingheads, the intermediate cut product is a block, and the precut modulefurther includes a second pair of profiling heads, the method furtherincluding: using the second pair of profiling heads to form a profile ofa second desired cut product along the workpiece, wherein the seconddesired cut product is a second side board; and severing the seconddesired cut product from the remaining portion of the workpiece.
 15. Asystem for processing a workpiece to obtain a desired cut product,wherein the workpiece is a log or a cant, and the desired cut product isa side board that has opposite faces, opposite longitudinal sides, andopposite ends, the system comprising: a precut module having one or morefirst cutting members; a first saw module downstream of the precutmodule; a second saw module downstream of the first saw module; and acomputer system operatively coupled with the precut module, the computersystem having a processor, a memory operatively coupled with theprocessor, and one or more programmable logic controllers (PLCs)operatively coupled with the processor and the precut module, the firstsaw module, and the second saw module, wherein the computer system isprogrammed with instructions operable, upon execution by the processor,to cause the one or more first cutting members of the precut module tocut the workpiece longitudinally along a first plane, such that the cutextends only partially through the thickness of the workpiece within thefirst plane; cause the first saw module to cut the workpiecelongitudinally along the first plane, such that the precut module andthe first saw module make corresponding first and second portions of athrough-cut through the workpiece along the first plane, to therebysever an intermediate cut product from a remaining portion of theworkpiece, wherein the intermediate cut product has a width that isgreater than the width of the desired cut product; and cause the secondsaw module to cut the intermediate cut product longitudinally into atleast a first piece and a waste piece, wherein the first piececorresponds to the desired cut product, and the waste piece has at leasta portion of a longitudinal side of the intermediate cut product,wherein the second saw module includes an edger, and the one or morefirst cutting members is one or more circular saws or profiling heads,and wherein the instructions are operable, upon execution by theprocessor, to determine a desired depth of cut for the first saw modulebased at least on a desired throughput speed through the first sawmodule, and determine the first portion or the second portion of thethrough-cut based at least on said desired depth of cut, wherein thesecond portion of the through-cut is less than or equal to the desireddepth of cut.
 16. The system of claim 15, wherein the one or more firstcutting members is one or more circular saws.
 17. The system of claim15, wherein the instructions are operable, upon execution by theprocessor, to determine a cut solution for the workpiece, wherein thecut solution defines the desired cut product.
 18. The system of claim17, wherein the instructions are operable, upon execution by theprocessor, to determine a first cut pattern for implementation by theone or more first cutting members of the precut module based at least onthe cut solution.
 19. The system of claim 17, wherein the one or morefirst cutting members is a profiler and the intermediate cut product isa block, and wherein the instructions are operable, upon execution bythe processor, to determine, based at least on the cut solution, a firstand a second cut pattern, wherein the first cut pattern is configuredfor implementation by the profiler and defines the longitudinal sides ofthe block, and the second cut pattern is configured for implementationby the profiler or the edger and defines the longitudinal sides of thedesired cut product.
 20. The system of claim 19, wherein theinstructions are operable, upon execution by the processor, to:determine a first difference, if any, in wood volume recovery for thefirst cut pattern relative to the second cut pattern; determine a seconddifference, if any, in throughput for the second cut pattern relative tothe first cut pattern; compare a value of the first difference to avalue of the second difference; and send the first cut pattern to theprecut module based on the comparison.
 21. The system of claim 19,wherein the instructions are operable, upon execution by the processor,to calculate an increase or decrease, if any, in wood volume recovery orthroughput speed through the first saw module for one of the cutpatterns relative to the other one of the cut patterns.
 22. The systemof claim 19, wherein the instructions are operable, upon execution bythe processor, to calculate a third cut pattern configured forimplementation by the second saw module to cut the block longitudinallyinto at least the first piece and the waste piece.
 23. The system ofclaim 18, wherein the cut solution defines the through-cut through theworkpiece, and wherein the instructions are operable, upon execution bythe processor, to compare a total depth of the through-cut to thedesired depth of cut, and calculate the first cut pattern based at leaston a difference between the total depth of the through-cut and thedesired depth of cut.
 24. The system of claim 23, wherein the first sawmodule includes one or more saws and the instructions are operable, uponexecution by the processor, to calculate a second cut pattern configuredfor implementation by the first saw module, and wherein the first cutpattern defines the first portion of the through-cut and the second cutpattern defines the second portion of the through-cut.
 25. The system ofclaim 17, further including a scanner positioned upstream of the precutmodule and configured to detect the workpiece, wherein the instructionsare operable, upon execution by the processor, to calculate the cutsolution based at least on data received from the scanner.
 26. Thesystem of claim 15, wherein the instructions are operable, uponexecution by the processor, to cause one or more second cutting membersof the precut module to cut the workpiece longitudinally along a secondplane, such that the cut made by the second one or more cutting membersextends only partially through the thickness of the workpiece within thesecond plane; cause the first saw module to cut the workpiece along thesecond plane to thereby sever a second intermediate cut product from theremaining portion of the workpiece; and cause the second saw module tocut the second intermediate cut product longitudinally into at least athird and a fourth piece, wherein the third piece corresponds to asecond desired side board.
 27. The system of claim 26, wherein the oneor more first cutting members and the one or more second cutting membersare profiling heads and the intermediate cut products are blocks, orwherein the first one or more cutting members and the second one or morecutting members are circular saws and the intermediate cut products areflitches, or wherein the first one or more cutting members are profilingheads and the first intermediate cut product is a block, and the secondone or more cutting members are circular saws and the secondintermediate cut product is a flitch.
 28. The system of claim 15,wherein the one or more first cutting members is a first pair ofprofiling heads, the intermediate cut product is a block, and the precutmodule further includes a second pair of profiling heads, and theinstructions are operable, upon execution by the processor, to cause thesecond pair of profiling heads to form both longitudinal sides of asecond desired cut product along the workpiece, wherein the seconddesired cut product is a second side board; and cause the first sawmodule to sever the second side board from the remaining portion of theworkpiece.